Reactive Ion Etcher (RIE) 1

Oxford, Plasmalab 80 Plus




Used for dielectric etching. Process gases include tetrafluoromethane, trifluoromethane, oxygen and argon.



Lab: TIC Level 7 Cleanroom
Location: TIC
University of Strathclyde
Owner: Ian Watson
Contact: Ian Watson

Further information

PURE Knowledgebase

Already a ULab user?

login to book this equipment

Not a ULab user?

register? to view more information or book this equipment